Internship or Thesis in Fundamentals of Laser Cutting on Technology Development (SS27)

Kick off your career during your studies at TRUMPF – discover innovation and shape technology! Take on exciting projects, actively contribute your ideas and work closely with experienced colleagues. In addition to individual support, you can expect numerous offers specifically for students that promote your personal and professional development. Gain valuable practical experience, expand your network and shape the technologies of tomorrow with us!

• You independently work on a current development topic in the field of laser cutting technology.
• Using state-of-the-art measurement technology, including high-speed cameras and sensors, you investigate the underlying processes.
• On high-performance laser cutting systems you independently plan and conduct experiments.
• You evaluate the experimental results obtained, prepare them and interpret them.
• Depending on the focus of your work, further topics such as image processing, programming or AI may be added.

• A degree in mechanical engineering, mechatronics, physics, optics, technical cybernetics or a comparable course of study forms your technical basis.
• Ideally you have initial practical experience in laser material processing, laser technology, technical optics, materials science or control engineering.
• Good programming skills are desirable.
• Very good German and good English skills in word and writing round off your language profile.
• In new tasks you show a structured and independent way of working, analytical and conceptual skills as well as a high degree of team orientation.